2026年11月11日 20:43 ET 发布 · 更新于 2 天前 · 1 个来源
South Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment
reuters
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原始报道
South Korean President Lee Jae Myung said on Thursday that Samsung Electronics' 6 trillion won ($4.48 billion) investment in a high-bandwidth memory chip packaging plant in Asan, South Korea, would be followed by about 40 trillion won in investment in advanced equipment.
原文