2026年8月21日 1:29 ET 发布 · 更新于 3 个月前 · 1 个来源
DayOne Seeks Loan to Fund Hong Kong Data Center Ahead of US IPO
bloomberg
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原始报道
DayOne Data Centers is seeking a HK$1.86 billion ($237 million) loan, according to people familiar with the matter, adding to the company’s recent borrowing spree ahead of a planned US initial public offering.
原文