2026年5月24日 21:30 ET 发布 · 更新于 6 个月前 · 1 个来源
Huawei Touts Chipmaking Breakthrough to Shorten Gap With TSMC
bloomberg
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原始报道
INFERY
Huawei Technologies Co. said it has come up with a new pathway to shorten its gap with industry leader Taiwan Semiconductor Manufacturing Co., potentially achieving a breakthrough in making advanced semiconductors without cutting-edge equipment.
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