Published Nov 11, 2026, 8:43 PM ET · Updated 2 days ago · 1 source
South Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment
reuters
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Original Report
South Korean President Lee Jae Myung said on Thursday that Samsung Electronics' 6 trillion won ($4.48 billion) investment in a high-bandwidth memory chip packaging plant in Asan, South Korea, would be followed by about 40 trillion won in investment in advanced equipment.